The thermomechanical procedure consisted of heating the sample to 1260 °C at a heating rate of 2 °C/s and soaking for 5 minutes (300 s) to homogenize the temperature and the microstructure. The samples were then cooled to the deformation temperature at a rate of 1 °C/s before being compressed to a total true strain of 0.8. The first deformation (first hit) was applied till a true strain of 0.5 followed by 5 s interpass time. The second pass (second hit) was then applied till a true strain of 0.3 followed by water quenching. The samples were mechanically polished using conventional metallographic preparation techniques and final polished using a Vibromet® polisher. Each sample was then placed in the SEM chamber with its compression axis parallel to the incident electron beam. The EBSD analysis was performed using a Hitachi SU-70 field emission gun scanning electron microscope equipped with Schottky emitter. Post-processing was done using Channel 5 HKLTM software. Low-angle grain boundaries (LAGBs, θ ˂ 2°) are marked red, while high-angle grain boundaries (HAGBs, θ ˃ 15°) are labeled black.